Materials
- FR-4
- FR-4 High TG
- Al Substrate
- CEM-1/CEM-3
- KB
- Isola
- Nanya
- C-Sem
- Hitachi Dry Film
- Taiyo Solder Mask Ink
- Kemmer Drill Bits
- Atotech Chemicals
Process Capability
- Thickness – 0.2–3.2mm
- 575x425mm (DS)
- 550x400mm (ML)
- Copper – 0.5 to 4 Oz
- 4/4 mil line width
- 0.15mm PTH hole
- SMT pitch 20 mil
- Blind & Buried Vias
- Controlled Impedance
PCB Type & Finish
- Single, Double, Multi Layer
- Aluminum Metal Core
- Black, Blue, Green, White, Red
- LF-HAL, Immersion Gold
- OSP & HAL finish
- Silkscreen Colors
- Peelable Mask